Cures fast for quick metal to metal bonding and repairs
Pots and encapsulates electronic components and assemblies
Seals against dust, dirt and combination
Fast curing, thin set, bonding above 5°C
A rapid curing, general purpose epoxy adhesive/encapsulant. It forms a clear, hard, rigid bond or coating in minutes.
7 minute fixture time
100% reactive, no solvents
Good dielectric strength
Bonds metal, fabrics, ceramics, glass, wood and concrete (in combinations)
Good solvent resistance

Product Type:Epoxy Adhesive/Encapsulant
Container Size:28.4 g
Container Type:Tube
Colour:Clear
Physical Form:Liquid
Viscosity Measurement:13000 cPs
Operating Temperature Range:-40 to +93 °C
Applications:Cures Fast for Quick Metal to Metal Bonding and Repairs;Pots and Encapsulates Electronic Components and Assemblies;Seals Against Dust;Dirt and Combination;Fast Curing;Thin Set;Bonding Above 5°C